(August 11, 2006) TOKYO and SANTA CLARA, CA — NEC Corporation, NEC Electronics, and subsidiary NEC Electronics America, together created a system-in-package (SiP) technology for stacking logic and gigabit-class memory in a single package. The technology will reportedly enable high-speed, high-definition image processing in mobile applications. The SMAFTI product combines a SMArt connection with a feed-through imposer. It uses a 3-D chip connection with an approximately 60-micron gap, and a 50-micron pitch microbump between the logic and memory devices. This system supports transmissions of up to 100 gigabits/sec. (Gbps).
