Qimonda, Winbond extend DRAM foundry pact

August 29, 2006 – Qimonda AG, the former DRAM unit of Infineon Technologies AG, and Taiwanese foundry Winbond Electronics Corp. have expanded their existing foundry manufacturing agreement.

Under the new deal, Winbond will exclusively manufacture Qimonda’s DRAMs for computing applications using 80nm DRAM trench technology, to be produced at Winbond’s 300mm facility in Taichung. The two firms were already producing 110nm and 90nm DRAM since 2002, utilizing Winbond’s Taichung fab and a 200mm facility in Hsinchu.

“The expansion of the process technology transfer to 80nm is an important step to maintain close collaboration between the two companies in the future,” stated Winbond chairman Arthur Chiao.

Kin Wah Loh, CEO of Qimonda, noted that the new deal increases the company’s production capabilities and flexibility — it already has access to five 300mm sites in the US, Europe, and Asia, with five major R&D facilities including its flagship site in Dresden, Germany.


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