Soitec breaks ground on Singapore fab

Small Times

Aug. 28, 2006 — Soitec, a Bernin, France-based manufacturer of silicon-on-insulator (SOI) wafers and other engineered substrates, announced it has broken ground on its new 300 mm wafer fab in Singapore. The groundbreaking ceremony marked the start of construction at the company’s newest production facility.

Designated Fab 3, the facility is expected to start supplying the group’s customer base with SOI wafers in mid-2008, as it ramps to a final production capacity of one million wafers per year.

Fab 3 is Soitec’s first fab in Asia. The company says it is a critical part of the group’s strategic investment plan to expand its worldwide production capacity, enhance its ongoing R&D efforts, and forge closer relationships with its customers.

The fab is intended to take advantage of the newest in manufacturing technologies — for example, it will utilize mini-environments in order to reduce wafer contamination risk and increase yields. The total investment in Fab 3 is expected to be approximately $448 million. When completed, it is anticipated that approximately 500 people will work in the facility.

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