Soitec breaks ground on Singapore SOI fab

August 28, 2006 – Soitec, Bernin, France, has officially broken ground on its new 300mm wafer fab in Singapore, announced earlier this summer.

Complementing investments totaling more than 350 million euros (US $) at its Bernin facilities this year, Soitec expects to also spend 350 million euros to build and ramp its new Fab 3 in Singapore’s Pasir Ris Wafer Fab Park. Production is slated to start in mid-2008, and ramping over a two-year period to reach full capacity of 1 million wafers/year.


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