Stair-step Packages Receive Attention

(August 16, 2006) SAN JOSE, CA &#151 A study testing high-speed, copper-based direct interconnections between IC packages, by means of a flexible circuit, indicates that 20 Gbps signaling on channels of relevant lengths is feasible, but the researchers decided that flex I/O will not enter the mainstream in the immediate future. The results were discussed in a paper authored by a team of Intel scientists and engineers and titled “Flex-circuit Chip-to-chip Interconnects.” It was presented at the IEEE CPMT Society’s Electronic Component and Technology Conference (ECTC). Hillsborough, OR; Santa Clara, CA; and Chandler, AZ Intel facilities participated in the study.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.