(August 21, 2006) SAN JOSE, CA and MUNICH, Germany &#151 Infineon Technologies, a German company, received a multi-million piece purchase order from the U.S. government for highly-secure ICs to go into the U.S. electronic passports. The passports include a chip in the cover that stores personal information, as well as a verification photo. The passports are constructed by a U.S. entity called the Government Printing Office. The Department of State handles the personalization of chips and other secure passport information.