AMD Licenses MTBSolutions Ultra-flat Package Technology

(September 27, 2006) SAN JOSE, CA &#151 Advanced Micro Devices (AMD) announced they have licensed ultra-flat package technology (UFPT) from MTBSolutions (MTBS). UFPT is primarily used for large-scale flip chip packaging structures where package flatness and the corresponding stress transmitted to the Si chip is a concern.

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