September 25, 2006 – AMD has hired Elke Eckstein, former CEO of IBM/Infineon JV Altis Semiconductor, as VP of the chipmaker’s Fab 30 site in Dresden, Germany, overseeing the facility’s day-to-day operations and its conversion to 300mm operations (after which it will be known as “Fab 38”).

Prior to joining AMD, Eckstein was CEO of Altis Semiconductor for three years; before that she was with Infineon (spun out of Siemens) in a variety of executive roles including R&D responsibility for the company’s Dresden-based manufacturing facility. She also has held executive roles in product and technology at ProMOS Technologies, a former JV between Infineon and Mosel Vitelic in Taiwan.

Earlier this year AMD said it would pour $2.5 billion into its facilities in Dresden, to convert Fab 30 to 300mm and expand capacity at Fab 36, moves that together could increase overall capacity at the operations by up to 4x by 2009. First wafer outs from Fab 38 are planned for 1Q08 with projected capacity of 20,000 wafers/month by 4Q08. [SEE WAFERNEWS STORY for more info, with input from Daryl Ostrander, AMD’s SVP of logic technology and manufacturing]