September 7, 2006 – Flextronics International Ltd., an electronics manufacturing services (EMS) provider and the world’s largest manufacturer of camera modules, has signed a deal with Tessera Technologies Inc. to incorporate wafer-level packaging technology in its entire camera module line.
The deal covers use of Tessera’s Shellcase CF technology, which was purchased in late 2005 through a $33 million acquisition of Israel-based Shellcase, and relaunched as a rebranded product in July of this year.
The Shellcase CF technology uses a novel encapsulation process to protect an image sensor’s active area from contamination during the initial stage of processing, allowing manufacturers to perform optical testing at their desired point of the assembly flow. It utilizes the manufacturing infrastructure of conventional chip-on-board assembly processes, including existing wire-bond assembly infrastructure and processes, according to the company.
“With the adoption of Shellcase CF, Flextronics provides a major boost for Tessera and the widespread adoption of its latest assembly technology,” according to Tom Hausken, director, optical components, Strategies Unlimited, in a statement provided by the company. “The market for image sensors used in mobile phones is growing rapidly, and the industry needs to address the yield issues resulting from decreasing pixel sizes with increasing image sensor resolution.”