Japan’s ULVAC testing C4NP molds

September 11, 2006 – Ulvac Coating Corp.’s glass MEMS division has demonstrated trial production of reusable glass molds used in C4NP (Controlled Collapse Chip Connection – New Process), the wafer bumping technology developed by IBM, according to the companies.

“The availability of a commercial source for high quality glass molds is one of the critical aspects of this new bumping technology” stated Emmett Hughlett, VP and business manager for C4NP at Suss MicroTec, adding that the Japanese firm has “exceeded our expectations from day one”.

C4NP places prepatterned solder balls onto the chip surface, by injection-molding bulk solder into reusable glass molds with etched cavities outlining desired bump patterns on the wafer. The mold cavities are filled with molten solder, which is subsequently transferred onto an entire wafer in a single step, eliminating the need for electroplating and enabling use of any alloy, including lead-free solders.


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