NanoWorld selects SUSS wafer bonding system

Sept. 18, 2006 — SUSS MicroTec, a Munich, Germany, supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced an order for its ELAN CB6L wafer bonding system to NanoWorld Services.

NanoWorld Services, located in Erlangen, Germany, is a developer, manufacturer, and supplier of integrated solutions for micro and nanotechnology. The company is part of the Swiss NanoWorld Group and specializes in the development and fabrication of microtechnological products, such as probes for scanning probe microscopy, based on semiconductor fabrication methods.

The ELAN CB6L manual wafer bonder is designedIspecifically for research, development, and pre-production wafer bonding markets. It has the same core technology as the SUSS fully automated bonders– including precise temperature and force during bonding, as well as computer controlled wafer processing — to ensure high-accuracy post bond alignment. The bonder is intended for MEMS, optoelectronic, advanced packaging and SOI applications.

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