Qimonda, UTAC Extend Joint Technology Co-operation

(September 25, 2006) SINGAPORE &#151 Singapore-based United Test and Assembly Centre (UTAC) announced the completion of its first R&D collaboration on ultra-thin, large die-stacking process development with Qimonda, Infineon Technologies memory spin-off. The companies will expand their collaboration to include advanced stacking and flip chip technology, and will extend the efforts for 18 months.

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