(September 20, 2006) NASHUA, N.H. — The mantra of smaller, faster, cheaper has never been so relevant as in today’s advanced packaging area. High-volume packaging still calls for high-accuracy, leading to the development of SMT-style package-assembly systems. University professors, OEMs, and contract assemblers (EMS providers) will discuss methods used for increasing densities — stacking, building more into a chip-scale package, mega-package with many technologies — in a lively and informative panel hosted by SMT Magazine at SMTA International, September 25 – 28, 2006. Packaging professionals at SMTAI will learn the next-generation of packaging — from ICs in cell phones to packaging traveling on space shuttles to Mars. The interactive panel, “Future Directions in Packaging,” held on Tuesday, September 26th from 10 – 11:30 a.m., will conclude with questions from the audience, questions for the audience, and copies of the presentations.
