SUSS Chooses ULCOAT for C4NP

(September 11, 2006) MUNICH, Germany &#151 At SEMICON Taiwan, SUSS MicroTec, Inc., announced that it has selected a potential commercial source for controlled collapse chip connection &#150 new process (C4NP) glass molds. The glass MEMS division of ULVAC Coating Corporation, based in Saitama, Japan, demonstrated trial production of the reusable glass molds needed to bump wafers using IBM’s C4NP process. The molds would be incorporated into SUSS C4NP processing equipment. Glass mold performance is a critical aspect for this bumping technology, said Emmett Hughlett, Ph.D., vice president and C4NP business manager at SUSS MicroTec, adding that SUSS found ULVAC highly qualified.

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