Thin-film Bonds Dissimilar Materials

(September 8, 2006) TOKYO &#151 Oki Electric Industry Co., with OKI Printing Solutions, developed a thin-film bonding technology to connect dissimilar materials. Epi film bonding (EFB) eliminates wire bonding and die bonding by exploiting a intermolecular bonding force.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.