September 25, 2006 – Tower Semiconductor Ltd. has signed a long-term foundry agreement to produce semiconductor wafers at its Fab 2 facility for power management chipmaker International Rectifier. Terms of the deal (e.g. payment structure or duration) were not disclosed.
“Tower’s experience in successful technology transfers, combined with a can-do attitude and great engineering talent, made it the best choice for us,” stated Alex Lidow, International Rectifier’s CEO.
Earlier this year Tower laid out a 50% acceleration of the production ramp at Fab 2, from current output of 15,000 200mm wafers/month to 24,000 wafers/month, including “a considerable increase” in capacity for 0.13-micron process technologies.