ULCOAT chosen as potential mold supplier for SUSS C4NP

Sept. 19, 2006 — SUSS MicroTec announced that the first potential commercial source for C4NP glass molds has been selected. SUSS explained that the Glass MEMS Division of ULVAC COATING CORPORATION (ULCOAT) of Saitama, Japan has successfully demonstrated trial production of the reusable glass molds needed to bump wafers using IBM’s C4NP process.

“The availability of a commercial source for high quality glass molds is one of the critical aspects of this new bumping technology,” said Emmett Hughlett, vice president and business manager for C4NP at SUSS MicroTec, in a prepared statement. “We are extremely pleased to have ULCOAT on board and they have exceeded our expectations from day one.”

C4NP stands for Controlled Collapse Chip Connection — New Process and is a next generation of wafer bumping technology developed by IBM.

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