The agreement reportedly offers AIT the capacity to accommodate increased requirements from IDT. AIT will provide assembly services for BGAs, and various leaded packages — TQFPs, PQFPs, TSOPs, SOICs, etc. The semiconductor assembly and test services (SATS) provider will transfer all assembly manufacturing from Penang, Malaysia, to its Batam, Indonesia facility, which is under expansion to meet full turnkey assembly and test service needs. In an additional 400,000 sq. ft., AIT will install equipment, leadframe and array package assembly, and test service areas.
(October 11, 2006) PHOENIX — FlipChip International LLC (FCI) demonstrated a product with an approximately 10× enhancement of reliability compared to standards of JEDEC JESD22-B111 Drop Test Specification for wafer-level chip-scale packaging (WLCSP) products. The company announced that enhanced lead-free (ELF) technology — developed at its Advanced Reliability Laboratory in Phoenix, AZ — combines advanced metallurgy and polymer technologies for reliability improvements.