Analyst: Copper conversion driving CMP growth

October 23, 2006 – Memory chipmakers’ conversion to copper damascene interconnect materials will drive 26% growth in demand for copper slurry for CMP, according to new data from market research firm The Information Network.

“We expect these manufacturers to start significantly increasing the use of copper interconnects in 2007,” stated president Robert Castellano, noting that NOR flash manufacturers have already started migrating, with NAND flash makers expected to start next year, and DRAM firms (except Micron Technology, which already has converted) migrating to copper in late 2007 or early 2008.

Copper slurry is expected to grow its share of the overall CMP slurry market to 45% in 2007 (of the total $800 million CMP market), up from 37% in the ~$700 million CMP market in 2006, the firm added. Leading the way: Cabot Microelectronics with a 32% share (2005), double that of its closest competitors Planar and Fujimi.


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