BOC, Aviza forge JDP to evaluate ALD precursors

October 30, 2006 – BOC Edwards and Aviza Technology Inc. have agreed to jointly develop atomic layer deposition (ALD) technology, combining BOC’s chemical precursor formulation with Aviza’s hardware to optimize deposition processes for high-k materials and metals.

The JDP also will serve to evaluate BOC’s new line of Flex-ALD precursors before full commercial release. The company says the precursors extend the range of ALD compatible compounds to include heavier elements not previously available.

“This partnership with BOC Edwards will support our advanced ALD film development efforts to offer a diverse set of films for multiple IC applications,” said Helmuth Treichel, VP of advanced applications at Aviza, in a statement, adding that combining BOC’s Flex-ALD precursors and ALD’s single-wafer and batch ALD platforms “will deliver to global IC makers added capability to incorporate in their advanced manufacturing.”


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.