Oct. 31, 2006 — BOC Edwards, a supplier of technology, equipment and support services to the electronics and microelectronics industries, and Aviza Technology Inc., a supplier of semiconductor equipment and process technologies, announced that they have entered into a joint development agreement to develop Atomic Layer Deposition (ALD) technology for advanced semiconductor manufacturing.
The collaboration will utilize BOC Edwards’ expertise in chemical precursor formulation and Aviza’s advanced ALD hardware technology to optimize deposition processes for high-k materials and metals.
BOC Edwards’ new line of Flex-ALD precursors enables the deposition of very pure thin films and extends the range of ALD compatible compounds to include heavier elements not previously available. The company says the novel precursors can reduce the cost and improve the efficiency of ALD processes by increasing precursor utilization, providing stable and consistent delivery without decomposition or condensation, and increasing growth rates for higher throughput. The Flex-ALD precursors will be evaluated as part of the agreement with Aviza before full commercial release.
Aviza offers both single-wafer and batch ALD platforms for DRAM, flash and logic device application needs. The Celsior single wafer ALD system is specifically designed to meet high-volume manufacturing and research and development requirements. Celsior features an innovative chamber, which offers increased throughput, lower chemical consumption and an extended process window.
The Verano 5500 batch ALD system is designed to process load sizes up to 100 wafers. Enabled by Aviza’s patent pending Across-Flow technology, the Verano 5500 is intended to provide process flexibility and film composition control that achieves single wafer results in a batch environment.