With low modulus and high adhesion to substrates, the AAA3300 and AAA3310 suit BGA and alloy 42 applications — assembly situations with concerns about substrate warpage. The material flows to cover the die during standard ramp-cure-profile times, and optional spaces offer bondline control. The AAA3320 suits same-die-stacking when low thermal coefficients (CTEs) are needed to reduce encapsulated-wirebond fatigue and failure. Advanced Applied Adhesives (AAA), San Diego, CA, www.appliedadhesives.com.
