DuPont, Taiyo Ink sign JDP for flipchip packaging films

October 12, 2006 – DuPont Electronic Technologies and Taiyo Ink Manufacturing Co. Ltd. have signed an agreement to jointly develop buildup microvia dry films for use in advanced flip-chip ball grid array packages. The target is a material offering with low CTE, superior adhesion, and improved signal integrity and speed, available for qualification early next year.

“Combining Taiyo Ink’s proprietary resin technology and expertise with DuPont’s filler, surface treatments and dispersion technologies will result in some exciting new products available for OEM qualification by early next year,” said David Miller, VP and GM of DuPont Electronic Technologies, in a statement.

“Taiyo Ink has established proprietary buildup resin materials and methods to maximize the compatibility of these resins with DuPont filler and dispersion technology,” added Yuichi Kamayachi, president and CEO of Taiyo Ink.


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