Dynamic Summits from Cadence and Microsoft

More companies are holding summits where they present recent corporate news and invite their customers, partners, and/or suppliers as presenters and attendees. While these events are high on glitz &#151 huge screens, video demonstrations, special effects &#151 they also tend to bring in dynamic speakers and provide an opportunity for networking among various players in the supply chain. Advanced Packaging Magazine attended Cadence’s “CDN Live! Silicon Valley” in San Jose and Microsoft’s “Global High Tech Summit” in Santa Clara, CA.

(October 12, 2006) FORT WASHINGTON, PA &#151 Kulicke & Soffa Industries, Inc. signed an agreement to acquire Alphasem from Dover Technologies International, Inc., a subsidiary of Dover Corporation. Alphasem supplies die-bonder and MEMS packaging equipment. In 2005, the company generated approximately $60 million in sales of die bonders and related materials, with 260 employees.


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