EV Group and Datacon extend cooperation on advanced-chip-to-wafer technology

Oct. 23, 2006 — EV Group, a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets and Datacon Technology GmbH, a leading supplier of flip-chip and die bonding equipment, announced the installation of an EVG540C2W System at Datacon.

During the long-term cooperation and development agreement in the field of advanced-chip-to-wafer (AC2W) technology, Datacon extended their application lab with EVG equipment. The AC2W technology combines Datacon’s leading expertise chip-bonding and key flip-chip bonding technologies with the unique wafer-level know-how from EV Group. It was developed in a joint R&D project.

In the AC2W technology, single chips are temporarily placed onto a carrier wafer with highest accuracy and high speed by a Datacon Flip-Chip bonder. In the next step, those stacked chips are permanent bonded on wafer-scale onto an EVG-bonding system.

During the initial phase, which started with the R&D project, the technology offered high device density through stacked devices, short interconnects and higher functional density for applications. The companies say the technology provides unique advantages for chip manufacturers as it enables the integration of various device processes such as hybrid integration of IC and MEMS functionality.

In addition, they claim the AC2W approach can generate packages that are an alternative to expensive embedded processes. It is intended to save device manufacturers time and money by combining the highest throughput and utilization of well established flip-chip and die attach processes with the permanent bonding process under well-controlled process parameters.

With these equipment installations, Datacon and EVG can now demonstrate and run the complete AC2W process, including metrology technologies, within one lab.

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