The technology collaboration puts chip bonding and flip chip bond technologies from Datacon together with wafer-level systems from EV Group. In AC2W assembly, single chips temporarily stacked onto carrier wafers by high-speed, high-accuracy flip chip placement systems are permanently bonded at the wafer level. It could provide hybrid integration of MEMS and ICs, and is an alternative to embedded processes.
(October 23, 2006) MINNEAPOLIS — Mark B. Thomas was named chief executive officer of microelectronics manufacturer HEI, Inc. He served as firm CFO since July, and will keep that post when he assumes CEO duties. Thomas succeeds Mack V. Traynor III, who will resign as director and CEO of the company.