FCI validated ELF with the CSP 50, a test vehicle for 0.5-mm pitch WLCSP, in specialized test facilities for board- and wafer-level mechanical stress testing. Production ramp-up for ELF began immediately across all product lines, says the company. ELF came out of a two-year-long effort toward reliability for form-factor-sensitive semiconductor product applications, such as advanced wireless handhelds, said Ted Tessier, chief technical officer. Drop test robustness is critical to these products.