Oct. 24, 2006 — Hymite A/S, a manufacturer of silicon-based packaging products for electronic devices, announced the expansion of its North American sales operations with the addition of a worldwide sales director and new offices in Rockwall, Texas. The expansion is designed to answer the growing market need for wafer-scale packages for consumer and industrial, medical and automotive components, including LEDs.
Hymite designs and supplies innovative wafer-scale silicon packages for MEMS and ICs that are significantly smaller and more cost-effective than traditional packaging, while conforming to standard QFN/SON specifications for high-volume applications. The company’s silicon packaging offers several advantages, including IC-style batch manufacture, package miniaturization, reduced labor costs and hermetic sealing.
The company hired Eric Leonard as director of worldwide sales. Leonard will help develop the company’s strategic sales direction and oversee all sales activity. He joined Hymite from Quantum Leap Packaging, where he oversaw strategic sourcing and built a global supply chain. Prior to that Mr. Leonard served as vice president at Amkor Technology, where he was responsible for managing an international team supporting assembly and test revenue of over $100 million. Hymite’s corporate offices are located in Copenhagen, Denmark and its main design facility is in Berlin, Germany.