IMEC and NSC Develop Copper-top Interconnect

(October 20, 2006) LEUVEN, Belgium and SANTA CLARA, CA &#151 IMEC transferred its copper-top interconnect process technology to production at National Semiconductor’s Malacca, Malaysia, facility. Copper-top interconnect &#151 a low-resistance, post-passivation interconnect module&#151 was designed to provide efficiency and smaller chip size for analog and mixed signal ICs.

(October 23, 2006) ST. FLORIAN, Austria &#151 Austrian companies EV Group and Datacon Technology GmbH installed an EVG540C2W system at Datacon’s application laboratory, for advanced chip-to-wafer (AC2W) development work.

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