Infineon unveils integrated MEMS tire pressure sensor

Oct. 23, 2006 — Infineon Technologies introduced its SP35 Tire Pressure Sensor, the first device to incorporate all the major active functions of a wheel-mounted Tire Pressure Monitoring System (TPMS) module into a single package.

The highly integrated device, which is mounted on a PCB (printed circuit board) with a battery and antenna to form a complete TPMS module, enables automotive industry suppliers to cost-effectively meet the requirements of U.S. safety regulations, and to address the growing worldwide demand for TPMS in new passenger cars and light trucks.

By eliminating the need for separate communications chips in the TPMS module, the SP35 reduces the complexity and cost of the module by approximately 10 percent. The single-package device integrates a MEMS pressure, acceleration and temperature sensor with an 8-bit microcontroller (MCU) and wireless communication between the TPMS module and the electronic control unit via an AM/FM (Amplitude Modulation/Frequency Modulation) RF transmitter and LF (low-frequency) receiver. The MCU silicon also includes memory, a battery voltage monitor, and advanced power control elements.

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