Lead-free Die-attach Adhesive

The MicrobondGecko die-attach adhesive for lead-free applications bonds die-attach connections to power components without soldering to a leadframe. The adhesive series can be tested and processed in the same way as high-lead solders. The metal-filled conductive adhesive reportedly creates a uniform and secure bond under high-temperature conditions and integrates into existing processes. Defects with the product are said to be lower than with traditional solders. Pastes in the series are defined by copper content. Umicore AG & Co., Hanau, Germany, www.microbond.eu.


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