(October 4, 2006) CHICAGO &#151 SMT Magazine’s panel at SMTA International focused on the possibilities and trends opening up in the packaging realm. Presenters ranged from government laboratory scientists to consultants and technology experts. SMT and Advanced Packaging editor-in-chief Gail Flower moderated the panel, with managing editor Michelle Boisvert to co-chair. Flower prefaced each presentation with an introduction to the presenter’s themes, along with a brief biographical introduction of the speaker. The main point that could not be emphasized enough was the effect of 3-D packaging on the industry. From proper X-ray inspection to applications in deep space, presentations educated the audience on what 3-D packaging means for practical and future applications.