The package encapsulates a diamond pin with a thin layer of AlSiC, a metal-matrix composite, with these positioned near hot spots, to provide a vertical, solid-state heat pipe to conduct heat out of the package. Adding thermal pyrolytic graphite at the top of the package dissipates heat across a broad area at the surface. Supplying thermal dissipation through 1,200 W/m-K thermal conductivity paths and a tailored coefficient of thermal expansion (CTE), the collaborative packages will target graphics processors, transportation power modules, and military communication components. While the cost of diamond is higher on a volume basis than other heat-spreader materials, its bill-of-materials (BOM) cost is said to offset the raw costs.

(October 10, 2006) SINGAPORE &#151 Advanced Interconnect Technologies (AIT) and Integrated Device Technology, Inc. (IDT), signed a multi-year, multi-million-dollar services agreement in which AIT will purchase assembly assets from IDT’s operations in Penang, Malaysia. The agreement will seamlessly integrate supply chain and technologies, according to Mike Hunter, vice president of worldwide manufacturing for IDT.