Flip chip interconnect will reportedly penetrate the market for wireless devices, logic, and other areas, due to favorable performance and form factor. The flip chip wafer-bumping market report segments data by product application, device type, package assembly, wafer count, and other criteria. Demand versus capacity, as well as geographical influences, provides forecasts for the market. The report lists contacts for service providers and suppliers.
(October 19, 2006) SAN JOSE, CA — For the second month in a row, the North American-based manufacturers of semiconductor equipment posted equivalent amounts in bookings and billings, creating a September book-to-bill ratio of 1.00, according to SEMI’s monthly report.