Symposium Keynote Evaluates Innovation

(October 30, 2006) SAN JOSE, CA &#151 William Bottoms, Ph.D., will keynote the MicroElectronics Packaging and Test Engineering Council (MEPTEC) symposium “IC Packaging and Test Roadmaps: Device Trends Impact on Packaging and Test Technology and Supply Chain,” on November 16, 2006, in San Jose, CA. Bottoms’ keynote will accompany four focus sessions on various aspects of the industry.

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