Taking a New Look at Packaging

Cubic Wafer emerged on the dynamic 3-D system-on-silicon (SoSi) packaging scene from a somewhat round-about route. Beginning in March, 2000, as Merrimack, NH-based Xanoptix, an optical transceiver technology provider, the company developed concepts and processes needed in the 3-D architecture and design realm, but perhaps ahead of their time, as little interest came in. Xanoptix rebuilt its business around its core technologies &#151 high-density contacts and through-die vias &#151 gearing up for 3-D packaging innovation instead of optical transceivers. The company changed its name to Cubic Wafer in August of 2005 to reflect the new direction.

Following are the highlights of upcoming events, including MEPTEC’s IC Packaging and Test Roadmaps Symposium, AP‘s New Trends in Sockets Webcast, the Conformal Coating & Dispensing Workshop, and the IWLPC.


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