Our first stop in New York was to Endicott Interconnect, where we learned about organic build-up substrates. Back row, left to right: Jeffrey Knight, VP business development and strategic planning; James Fuller, VP and general manager, PWB and semiconductor packaging; Vernon Wells, marketing specialist. Front row, left to right: Mark Ponzi, semiconductor manufacturing operations manager; Theresa Taro, director of marketing and communications; Kathy Poggi, associate publisher; Gail Flower, editor-in-chief; Meredith Courtemanche, assistant editor; and Françoise von Trapp, managing editor. Click here to enlarge image
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Display of EI’s HyperBGA lamination layout diagram of the steps to create a panel that then becomes BGA substrates.Click here to enlarge image
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In the cleanroom, Nicole Swick, technician, removes final particles from the material.Click here to enlarge image
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In the mini-lab Ron Whiting, plating technician, performs an analysis of plating baths.Click here to enlarge image
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The birthplace of IBM, in Endicott, NY.Click here to enlarge image
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James McNamara, president and CEO, greets Gail Flower.Click here to enlarge image
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We arrived at Universal just in time to hear the big news about their split from Dover, and the formation of Unovis. Pictured from left to right: Françoise von Trapp; Jeroen Schmits, president of Universal; Kathy Poggi; Meredith Courtemanche; Karen Moore Watts, director of global marketing; Gail Flower; and George Westby, director of the Advanced Process Laboratory.Click here to enlarge image
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Sample preparation area for evaluating lead alloys. Mechanical tests are performed and then packages are cross-sectioned and examined for cracks.Click here to enlarge image
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George Westby explains the thermo gravimetric analyzer/ Fourier transform infra red (TGA/FTIR) apparatus and its use for materials research.Click here to enlarge image
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B&L metallogragh used for examining cross sections.Click here to enlarge image
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Tia Korhonan, material scientist, uses a pull tester to perform failure analysis tests on solder balls.Click here to enlarge image
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In search of our next gig – the Roadshow crew takes five.Click here to enlarge image
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Indium welcoming committee included, from left to right: Tim Jensen, lead-free program manager; Rick Short, director, marketing communications; Anita Brown, supervisor, marketing communications; Carol Gowans, product manager, fabricated products; Gail Flower; Meredith Courtemanche; David Sbiroli, applications development program manager; Jordan Ross, product specialist, engineered solders; Kathy Poggi; Françoise von Trapp; and Jim Hisert, applications engineer.Click here to enlarge image
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Kathy Poggi conducted some thermal management experiments of her own.Click here to enlarge image
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As it turns out, toast is not a good thermal conductor. Indium, on the other hand, works great.Click here to enlarge image
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Rick Short educates the Roadshow crew on the origins of indium, illustrating his lesson with a schematic of a 20th century mine.Click here to enlarge image
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Bob Davidson, lab technician, screens fluxes for use in solder paste.Click here to enlarge image
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Jim Hisert explains how the paste inspection machine examines and analyzes paste deposits to see how materials perform throughout the printing process.Click here to enlarge image
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