Acacia announces wafer bonding technology patents

Nov. 8, 2006 — Acacia Research Corp. announced that Acacia Patent Acquisition Corp., a wholly owned subsidiary that is part of the Acacia Technologies licensing group, has acquired rights to a patent relating to aligned wafer bonding technology.

This company said the technology relates to the precision alignment and bonding of micromechanical, electrical and optical structures. An Acacia statement said the technology can be used for the bonding of surface features in the fabrication of MEMS and semiconductor devices.

The Acacia Technologies group develops, acquires, and licenses patented technologies. Acacia controls 53 patent portfolios, which include U.S. patents and certain foreign counterparts, covering technologies used in a wide variety of industries.

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