Cabot hiking prices for two CMP polishing slurries

November 6, 2006 – Cabot Microelectronics Corp. is increasing global prices for its Semi-Sperse and Cab-O-Sperse CMP polishing slurry lines, used for interlayer dielectrics and general-purpose oxide polishing applications, starting Dec. 1.

The company says the price increases are overdue after continued investments in improvements to the lines, which have maintained flat prices since their introduction in the early 1990s.

“For more than a decade, Cabot Microelectronics has continually invested in improving these products to meet increasing performance demands as semiconductor technology has advanced, and our customers have benefited from these improvements,” stated Stephen Smith, VP of marketing. “We plan to continue to invest in further improving these products as well as introducing new and higher performing products for similar applications.”


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