Canadian NanoFab installing SUSS wafer bonder

Nov. 22, 2006 — SUSS MicroTec, the Munich, Germany-based supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, announced that the University of Alberta’s NanoFab has selected its new ELAN CB6L wafer bonding equipment for its research and production activities.

The NanoFab is an open access micro and nano fabrication facility which is currently being used by more than 130 research groups from the University of Alberta, other Canadian Universities and industry. The SUSS ELAN CB6L manual bonder will be used in nanotechnology research, pressure sensors for the oil industry, and RF MEMS switches for wireless applications.

The ELAN CB6L manual wafer bonder is designed for research, development, and pre-production wafer bonding markets. It has the same core technology as the SUSS fully automated bonders — including precise temperature and force control during bonding, as well as computer controlled wafer processing. It is intended for MEMS, optoelectronic, advanced packaging, and SOI applications.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.