FormFactor sues Japan firm over probe card IP

November 21, 2006 – FormFactor Inc. has filed new patent litigation against Micronics Japan Co. Ltd. (MJC) alleging infringement upon four US patents covering the company’s wafer probe card technology.

The US patents at issue are the same four that FormFactor has disputed with Korean firm Phicom in both Korea and the US — US Patent #6,246,247 for “Probe card assembly and kit, and methods of using same”; #6,509,751 for “Planarizer for a semiconductor contactor”, #6,624,648 for “Probe card assembly”, and #7,073,254 for “Method for mounting a plurality of spring contact elements”. All the cases are still pending.

“We can not condone unauthorized third parties using our proprietary technology, and this latest infringement action is a necessary step to protect our investment in research and development,” said Igor Khandros, FormFactor CEO, in a statement.

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