CORWIL Adds SiP Services

(December 13, 2006) MILPITAS, CA &#151 CORWIL Technology Corporation added services to its system-in-package (SiP) and multi-component packaging (MCP) module customers. The semiconductor assembly and test services (SATS) provider joined substrate design and fabrication sources to provide reportedly turnkey SiP module design, substrate fabrication, and packaging services.


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