Dec. 1, 2006 — EV Group (EVG), a St. Florian, Austria, supplier of wafer-bonding and lithography equipment for the advanced packaging, MEMS and semiconductor markets, and Sonix Inc., a supplier of advanced acoustic NDT solutions for bonded wafers & MEMS, announced they are joining forces as Sonix selects EVG as their exclusive worldwide reseller/distributor of selected Sonix products.
In addition to the EVG product portfolio, EVG will now offer Sonix Wafer Acoustic Microscopes. As a result of this agreement, Sonix and EVG said they are committed as strategic partners in providing the most innovative and technologically advanced solutions for bonding wafers and non-destructive acoustic inspection systems for all wafer level integration and packaging from R&D to production.
Sonix Inc., in Springfield,Virgina, a wholly owned subsidiary of the Danaher Corporations, is a manufacturer of scanning acoustic microscopes and non-destructive testing equipment.