IC/DT Patent Awarded to STI

(December 8, 2006) MADISON, AL &#151 STI Electronics, Inc. (STI), was awarded a patent for its imbedded component/die technology (IC/DT), which involves the use of integrated circuit (IC) imbedded within a laminate substrate disposed on a thermally conductive core, providing a thermal sink. STI applied for the patent on May 23, 2003; it was awarded on October 3, 2006.

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