IMEC Demonstrates 3-D Stacked IC integration
(December 11, 2006) SAN FRANCISCO — At the IEEE International Electron Devices Meeting (IEDM), IMEC demonstrated thinned bulk-silicon die containing through-silicon vias (TSVs) stacked and interconnected by direct copper-to-copper thermo-compression bonding.
POST A COMMENT
Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.