A motorized take-up option gathers the protective liner from dicing tape operating on wafer mounters. The system gathers the liner into a disposable core, easing clean-up and reportedly helping operators to pull the tape from the roll. It is an option on new back-lap tape applicators and wafer/frame mounters, and retrofits to existing machines. Semiconductor Equipment Corporation (S.E.M.), Moorpark, CA, www.semicorp.com.