Paste Adheres for Image Sensor Modules

(December 13, 2006) IRVINE, CA &#151 A non-conductive paste (NCP) underfill and encapsulant, Hysol FP5110 from Henkel adheres flip chip image sensor modules to 2- and 3-layer flexible printed circuits. Image sensors are a component in nearly half of mobile phones in production, according to Robert Chu, global product manager for CSP underfills.

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