University Selects SUSS Wafer Bonder

(December 4, 2006) MUNICH, Germany &#151 The University of Alberta’s NanoFab chose SUSS MicroTec’s ELAN CB6L wafer-bonding equipment for its research and production activities. The NanoFab is an open access micro- and nano-fabrication facility used by more than 130 research groups from the University of Alberta, other Canadian universities, and industry. The manual bonder will be used in nanotechnology research, RF MEMS switches for wireless applications, and other research activities.

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