AMI Ramps Production with AIT SiP

(January 29, 2007) SINGAPORE &#151 AMI Semiconductor is in full production mode with Advanced Interconnect Technologies (AIT) stacked-die quad flat package no leads (QFN) modules. AMI will incorporate the packages into several consumer electronics applications. The QFN-MCM product uses a pyramid formation of stacked, wire-bonded die in a system-in-package (SiP), explained Chris Stai of AIT.


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