APEX 2007 Pursues Interest in Packaging

Following is a preview of the advanced packaging industry on display at IPC Printed Circuits/APEX/Designers Summit 2007, February 20 &#150 22, in Los Angeles. Look for more APEX previews leading up to the show in the newsletter and the January/February issue of Advanced Packaging.


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.